Pack4EU’s core objective is to assess the current status of semiconductor packaging, assembly, and test facilities and capabilities in Europe. Additionally, it aims to analyze the evolving needs of the semiconductor industry regarding advanced packaging, assembly, and test developments.
The focus includes mapping existing facilities, evaluating technological capabilities, and identifying areas for improvement.
Ultimately, the project seeks to inform strategic decisions aligning with the semiconductor industry’s dynamic requirements.
VDI/VDE-IT is leading a work package analysing and presenting the existing activities and funding mechanisms at European and national level in the field of advanced packaging. Based on this, recommendations for action are to be derived for the European Commission to strengthen the semiconductor industry. In addition, VDI/VDE-IT is responsible for the creation and design of a pan-European network that unites all relevant players in the field and gives them a common voice.
VDI/VDE-IT informs about the progress of the project via the LinkedIn channel Pack4EU.
